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WS256K32L-25HCA Datasheet

256Kx32 SRAM MODULE
Manufacturer
Description

256Kx32 SRAM MODULE

FEATURES
■Access Times 20, 25, 35ns
■MIL-STD-883 Compliant Devices Available
■Packaging
   • 66 pin, PGA Type, 1.185 inch square, Hermetic Ceramic HIP (Package 401)
   • 68 lead, 40mm, Hermetic CQFP (Package 501)
■Organized as 256Kx32, User Configurable as 512Kx16
■Upgradable to 512Kx32 for future expansion
■Data I/O Compatible with 3.3V devices

■2V Data Retention devices available (WS256K32L-XXX low power version only)
■Commercial, Industrial and Military Temperature Range
■5 Volt Power Supply
■Low Power CMOS
■TTL Compatible Inputs and Outputs
■Weight
   WS256K32N-XHX - 13 grams typical
   WS256K32-XG4X - 20 grams typical

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